Summary: Innovative high-tech company seeks experienced senior Operations / Process Technologist to interface with foundry and R&D teams to ensure the company maintains its global leading edge. Manufacturing Engineer (CMOS Solutions) – Foundry, Semiconductor, Operations, Project Management, Process Control, RF SoC. Cambridge, c£50,000 DOE + excellent benefits.
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As Principal Advanced Process Technologist, you will work with research design engineers and end user teams to determine device characteristics to ensure they meet requirements proposed by customers. You will work with suppliers / subcontractors (especially main foundry) for advanced process technologies and achieve tape-out of test chips.
Key responsibilities:
- Strategy: development of advanced process strategy in conjunction with R&D, senior management and end user teams.
- Technical: Interface with foundry suppliers, acting as an authority on process offerings and qualifications; develop process improvement programs including design and characterise test chips; provide regular technology awareness updates; align technology roadmaps; manage tapeout activities; understand IP, and generate and file patents for new devices; supervise junior members.
- Commercial: maintain and develop strong relationships between the client and foundry sub-contractors (including liaising with senior executives in Asia); participate in quarterly review meetings with foundry; manage layout and measurement work of sub-contractors.
You will have:
- Proven hands-on industry experience/understanding of process integration of advanced CMOS technologies, device architecture and performance, and memory technologies such as embedded flash, OTP, MTP;
- Ability to generate device layout and run DRC checks;
- Knowledge of Analogue and/or RF design knowledge, experience with Cadence Virtuoso, and compact models;
- Ability to analyse measured data and make conclusions and recommendations;
- In depth knowledge of 65nm, 40nm & 28nm CMOS technologies, and semiconductor industry trends.
Further sttributes are desirable: Excellent problem solving and statistical analysis skills; Understanding of advanced node foundry integration schemes (FEOL and BEOL) including challenges & solutions; Design rule rationale & trade-offs; Understanding of advanced packaging technology (TSV, Interposers, 3D integration, IPDs); Ability to use probe station to make device measurements.
This is a fantastic opportunity for an authority in the semiconductor industry to work with a leading chip company, and implement key decisions in the next generation of chips.
Keywords: Process, Chips, Foundry, R&D, CMOS, IP, RF, tapeout activities, embedded flash, strategy, roadmap
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